Thin Wall Packaging

Thin wall molding applications such as packaging require high speed injection and high injection pressure. Also, wall thicknesses of less than 0.025 inch (0.62mm) and a flow length to wall thickness ratio greater than 200 are required. MDI’s dynamically balanced, one-piece solid manifolds with custom designed flow channels provide optimum balance for uniform thin wall molded packaging products.

Our Nozzles are internally heated, high quality and durable to withstand the high injection molding pressures, yielding excellent gate quality at fast cycle times.