Thin Wall Packaging
Thin wall packaging applications require high speed injection and high injection pressure. Also, wall thicknesses of less than 0.025 inch (0.62mm) and a flow length to wall thickness ratio greater than 200 are required. Our dynamically balanced one-piece solid manifolds with custom designed flow channels provide optimum balance for uniform thin wall molded packaging products.
Our Nozzles are internally heated, high quality and durable to withstand the high injection molding pressures, yielding excellent gate quality at fast cycle times.